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COMPONENT PACKAGES

WSON Component Package

Date Published:	January 21, 2015
Last Modified:	January 21, 2015

Overview

Name	WSON (Small-outline No-lead Package)
Synonyms
Variants	Varying number of pins.
Similar To	SOIC
Mounting	SMD
Pin Count	8 (all also have exposed thermal pad)
Pitch	1.27mm (just like SOIC), except for Texas Instrument's WSON
Solderability	Hard to solder with a soldering iron due to underside thermal pad.
Thermal Resistance
Dimensions	WSON-8 Package: 6.0x5.0x0.80mm (wlh, Winbond package code ZP) Recommended Land Pattern: 6.10x5.10mm (31.11mm2)
3D Models
Common Uses	Flash memory ICs Secondary-side bias regulators for DC-DC converters

Comments

The WSON package has a exposed thermal pad on the underside. However, it is not normally electrically connected to anything, and is optionally soldered to the PCB. It is recommended to be soldered when the PCB has a large amount of flex, else left unconnected.

Below is an “odd shaped” SON package used by Numonyx flash chips that goes under the name VDFPN8. Notice the half-round appearance of the pins.

Outline and dimensions for the VDFPN8 (SON-8) component package of a Numonyx flash IC.Image from http://www.micron.com/~/media/Documents/Products/Data%20Sheet/NOR%20Flash/Serial%20NOR/M25P/M25P128.pdf.

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