COMPONENT PACKAGES

TO-Leadless Component Package

Date Published:
Last Modified:

Overview

NameTO-Leadless (Transistor Outline Leadless)
Synonymsn/a
Variantsn/a
Similar Ton/a
MountingSMD
Pin Count8 + exposed pad
Pitch1.20mm
SolderabilityNot suitable for hand soldering due to pads underneath the package. Suitable for hot air and reflow soldering techniques.
Thermal Resistance
  • \(R_{JC} = 0.4^{\circ}{\rm C}/W\)
  • \(R_{JA} = 40^{\circ}{\rm C}/W\) (max)
Dimensions11.7x9.9x2.3mm
Land Area116mm2
3D Modelsn/a
Common UsesHigh-power MOSFETs (e.g. with 300A current capability)

Comments

As far as I know, the TO-Leadless package is solely used by Infineon for a range of it’s high power MOSFETs. In this package, Infineon’s MOSFETs can achieve on-resistances as low as 0.4mΩ. It’s package size is 60% smaller than the D2PAK 7-pin package.

3D Render

A 3D render of the TO-Leadless component package.

A 3D render of the TO-Leadless component package.

Images

To leadless component package 3d model front back

To leadless component package 3d model front back

To leadless component package dimensions

To leadless component package dimensions

To leadless component package recommended land pattern

To leadless component package recommended land pattern

To leadless component package recommended stencil

To leadless component package recommended stencil

To leadless component package size comparison with d2pak

To leadless component package size comparison with d2pak

To leadless component package trapezoidal grooves for optical checking

To leadless component package trapezoidal grooves for optical checking

Like this page? Upvote with shurikens!

Related Content:

Tags:

comments powered by Disqus