Recent Updates:

October 2019 Updates

Modified: 31 October, 2019

Blog updates during October 2019.

Jupyter

Modified: 28 October, 2019

A tutorial on Jupyter Notebooks and Jupyter Labs.

Rotation Matrices

Modified: 26 October, 2019

An introduction to rotation matrices. What they are, how to calculate them, and what they are useful for!

Quaternions

Modified: 14 October, 2019

A tutorial on quaternions, including calculators to convert between quaternions, rotation matrices and axis-angle notations.

Visual Studio Code

Modified: 11 October, 2019

Shortcuts, key bindings, compiling C/C++ and more info about the Visual Studio Code IDE.

COMPONENT PACKAGES

D2PAK (TO-263) Component Package

Date Published:	April 7, 2015
Last Modified:	April 7, 2015

Overview

Name	Transistor Outline 263
Synonyms	TO-263 (Transistor Outline 263) D2PAK (Double Decawatt package) DDPAK TO-263AB (TO-263-3S only) TO-279 (TO-263 THIN only) SMD-220 (because the TO-263 is the SMD equivalent of the TO-220).
Variants	TO-263-X1X2 (where X1 is the lead count and X2 is the length of the centre pin). TO-263 THIN (a thinner variant of the standard TO-263 package by Texas Instruments)
Similar To	TO-220
Mounting	SMD
Pin Count	3, 5, 7, or 9 (this is X1). All packages also have a thermal pad.
Pitch	TO-263-3, TO-263-3S: 2.54mm TO-263-7, TO-263-7S: 1.7mm
Solderability	Easy to solder by hand, as long as you have a decent powered soldering iron for the central thermal pad. Easy to solder with infrared and reflow techniques.
Thermal Resistance	TO-263-3 \(T_{JA} = 18.0^{\circ}{\rm C}/W\) (1 square inch of copper surrounding pads, connected to ground) \(T_{JA} = 33.6^{\circ}{\rm C}/W\) (copper filling package land-area) \(T_{JA} = 36.7^{\circ}{\rm C}/W\) (pads only, no copper fill) TO-263-5L THIN \(T_{JA} = 22.0^{\circ}{\rm C}/W\) (no air flow, on JEDEX 4-layer test board)
Land Area	n/a
Height	All except TO-263 THIN: 4.57mm TO-263 THIN: 2.00mm
3D Models	TO-263-3 TO-263-3S TO-263-5 TO-263-5S TO-263-7S
Common Uses	High power MOSFETs High power LDOs High power SMPS (usually with integrated switching element)

The Standard Package (TO-263)

This package can be considered the SMT version of the TO-220AB. It is a 3, 5 or 7 leaded heavy-duty package that allows for good heat-sinking due to a large pad on it’s underside. Used frequently for high power MOSFETs, LDOs and SMPS. Comes with either a normal middle lead (X2 = nothing) or a short, cut-off middle lead (X2 = S).

A 3D render of the D2PAK (TO-263) component package.

The synonym for the TO-263 package, D2PAK, stands for “double decawatt package”. It was designed by Motorola for high power devices.

Thermal Resistance

The junction-to-ambient thermal resistance for the TO-263 component package on both standard JEDEC 2-layer and 4-layer boards is shown below:

TO-263 THIN

TO-263 THIN is a variant of the TO-263 component package by Texas Instruments. It shares a similar PCB footprint, but is significantly smaller in height (i.e. thinner).

It still has a similar exposed pad on it’s underside (making it footprint compatible with the standard TO-263 package).

The exact dimensions of the TO-263 THIN package are shown in the below image:

The dimensions for the TO-263 THIN component package. Image built from elements taken from www.ti.com.

Like this page? Upvote with shurikens!